• DocumentCode
    2524370
  • Title

    Experiment study on the heat transfer coefficient of evaporative flow in mini/microchannels

  • Author

    Liu, DongYao ; Weng, Xia ; Xu, XiaoGuang

  • Author_Institution
    Sch. of Power Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
  • fYear
    2010
  • fDate
    10-12 Sept. 2010
  • Firstpage
    347
  • Lastpage
    352
  • Abstract
    The heat transfer coefficients of the evaporative water flow in mini/microchannels are studied experimentally to explore the novel heat dissipation for high power electronics. Two sets of parallel channels which are 61 channels with hydraulic diameter of 0.293mm and 20 channels with hydraulic diameter of 1.2mm are investigated respectively. The inlet and outlet temperatures of fluids, and the temperatures beneath the channels are measured to calculate the heat dissipation of the evaporative water in channels. The experiments are carried out with the volume flow rates range from 20ml/min to 80ml/min and the effective heat flux range from 5W/cm2 to 50W/cm2, and the resulted outlet vapor qualities range from 0 to 0.8. The relations of the heat transfer coefficient with heat flux and vapor quality are analyzed according to the results. The experimental heat transfer coefficients are compared with the prediction of latest developed correlations. A new correlation takes the effect of Bond number is proposed, and be verified that it is effective to predict the heat transfer coefficient of both minichannels and microchannels in a large range of vapor qualities.
  • Keywords
    evaporation; heat transfer; microchannel flow; evaporative flow; heat dissipation; heat transfer coefficient; high power electronics; mini/microchannels; parallel channels; Computers; Cooling; Water heating; Correlations; Evaporation flow; Experimental study; Heat Transfer Coefficient; Microchannels; Minichannel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechanical and Electrical Technology (ICMET), 2010 2nd International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8100-2
  • Electronic_ISBN
    978-1-4244-8102-6
  • Type

    conf

  • DOI
    10.1109/ICMET.2010.5598380
  • Filename
    5598380