DocumentCode
252510
Title
Monolithic 3D integration advances and challenges: From technology to system levels
Author
Ebrahimi, M.S. ; Hills, G. ; Sabry, M.M. ; Shulaker, M.M. ; Hai Wei ; Wu, T.F. ; Mitra, S. ; Wong, H.-S.P.
Author_Institution
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear
2014
fDate
6-9 Oct. 2014
Firstpage
1
Lastpage
2
Abstract
Recent technological advances in monolithic 3D integration lay the foundation for highly efficient next-generation computing systems. These advances, however, can only be utilized to their full potential if system architectures are properly optimized by utilizing monolithic 3D-IC technology for target applications. Thus, a multidisciplinary research framework from system architecture to technology layers, and several experimental demonstrations are required.
Keywords
monolithic integrated circuits; three-dimensional integrated circuits; monolithic 3D integration; monolithic 3D-IC technology; multidisciplinary research framework; next-generation computing system; system level; Bandwidth; Random access memory; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location
Millbrae, CA
Type
conf
DOI
10.1109/S3S.2014.7028198
Filename
7028198
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