Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor

Author

Di Federico, M. ; Julian, P. ; Andreou, A.G. ; Mandolesi, P.S.

Author_Institution

Dept. de Ing. Electr. y de Computadoras, Univ. Nac. del Sur, Bahia Blanca, Argentina

fYear

2014

fDate

6-9 Oct. 2014

Firstpage

1

Lastpage

2

Abstract

This paper presents the first fully functional fine-grain 3D vertically integrated focal plane system processor, implemented in the 3D interconnection technology of Tezzaron Semiconductors. The processor consists of an array of cells, auxiliar structures and general purpose blocks. The chip can acquire video and apply a series of image processing tasks to each frame employing local computation among cells. The chip has been successfully tested at 50Mhz.

Keywords

image processing; integrated circuit interconnections; three-dimensional integrated circuits; 3D interconnection technology; auxiliar structures; cell array; focal plane neuromorphic processor; frequency 50 MHz; fully functional fine-grain vertical 3D integration; general purpose computation blocks; image processing tasks; Arrays; Conferences; Integrated circuit interconnections; Prototypes; Three-dimensional displays; 3D integration; focal plane processor;

fLanguage

English

Publisher

ieee

Conference_Titel

SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE

Conference_Location

Millbrae, CA

Type

conf

DOI

10.1109/S3S.2014.7028244

Filename

7028244