• DocumentCode
    2526589
  • Title

    Low threshold voltage CMOS devices with smooth topography for 1 volt applications

  • Author

    Yu, D.C.H. ; Lin, H.D. ; McAndrew, C. ; Lee, K.H.

  • Author_Institution
    AT&T Bell Labs., Orlando, FL, USA
  • fYear
    1994
  • fDate
    11-14 Dec. 1994
  • Firstpage
    489
  • Lastpage
    492
  • Abstract
    CMOS devices with ultra-low threshold voltage, high performance, and smooth topography are fabricated for 1 volt applications. Novel features of the devices include (1) enhanced self-aligned twin-tub with low surface dopant level, deep concentration profile, and low n-p tub boundary height, (2) dual-gate implant with wafer tilted to achieve thin gate height while suppressing ion penetration, and (3) use of hard-mask and sidewall dielectrics to protect the TiN dual-gate shunt layer against oxidation. Excellent device characteristics has been demonstrated in this work.<>
  • Keywords
    CMOS integrated circuits; MOSFET; doping profiles; integrated circuit technology; ion implantation; surface topography; 1 V; 1 volt applications; TiN; deep concentration profile; dual-gate implant; dual-gate shunt layer; hard-mask; high performance devices; low threshold voltage CMOS devices; self-aligned twin-tub; sidewall dielectrics; smooth topography; tilted wafer; ultralow threshold voltage; Annealing; Boron; Costs; Doping; Implants; Low voltage; Surface topography; Temperature; Thermal resistance; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2111-1
  • Type

    conf

  • DOI
    10.1109/IEDM.1994.383362
  • Filename
    383362