P4 probe card-a solution for at-speed, high density, wafer probing

Author

Pandey, Rajiv ; Higgins, Dan

Author_Institution

Cerprobe Corp., Gilbert, AZ, USA

fYear

1998

fDate

18-23 Oct 1998

Firstpage

836

Lastpage

842

Abstract

We introduce a promising new probe card technology the P4 (Photolithographic Pattern Plated Process) probe card-which offers a solution for at-speed wafer probe at high pin count applications. We describe the P4 probe card, highlight some of its features such as its unique construction, which allows it to perform with the robustness of an epoxy-ring probe card on aluminum pads, yet enables high frequency probing up to 9 GHz bandwidth. We present data on the electrical and mechanical characteristics of the P4 probe card such as bandwidth, crosstalk, contact resistance and probe tip force/deflection performance

Keywords

automatic testing; contact resistance; crosstalk; integrated circuit testing; probes; 9 GHz; P4 probe card; at-speed wafer probing; contact resistance; crosstalk; epoxy-ring probe card; force/deflection performance; high frequency probing; high pin count applications; mechanical characteristics; photolithographic pattern plated process; probe tip; Aluminum; Bandwidth; Biomembranes; Circuit testing; Frequency; Integrated circuit packaging; Integrated circuit testing; Manufacturing; Needles; Probes;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1998. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-5093-6

Type

conf

DOI

10.1109/TEST.1998.743271

Filename

743271