• DocumentCode
    2527044
  • Title

    The mechanism of electrical conduction in polyethylene/carbon black composite

  • Author

    Xi, B. ; Chen, G.

  • Author_Institution
    State Key Lab. of Electr. Insulation for Power Equipment, Xi´´an Jiaotong Univ., China
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1015
  • Abstract
    The mechanism of electrical conduction in the polyethylene (PE)/carbon black (CB) composite is investigated. It is found experimentally that there are three distinct regions in the J-E curve of the PE/CB composite. On the basis of the energy bands of the conductance grain-insulation dielectric-conductance grain system, the electrical conduction equation can be derived correspondingly according to the change in barrier potential under different electric fields. It shows that J∝E at low field strength, Log J/E∝E at middle-field strength and Log J/E∝-1/E at high field strength. The equations fit well with the results obtained from experiments. The evidence suggests that the conduction mechanism in the PE/CB composite can be attributed to electrons tunnelling through the intergranular gaps among the CB particles
  • Keywords
    band structure; electrical conductivity; filled polymers; particle reinforced composites; polyethylene insulation; tunnelling; J-E curve; barrier potential; conductance grain-insulation dielectric-conductance grain system; electric fields; electrical conduction equation; electrical conduction mechanism; electron tunnelling; energy bands; intergranular gaps; low field strength; middle-field strength; polyethylene/carbon black composite; Composite materials; Dielectrics and electrical insulation; Differential equations; Electric potential; Electrons; Laboratories; Polyethylene; Polymers; Temperature; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5459-1
  • Type

    conf

  • DOI
    10.1109/ICPADM.2000.876404
  • Filename
    876404