• DocumentCode
    252753
  • Title

    Microfabrication of high aspect ratio microtube arrays to store high density charged particles

  • Author

    Narimannezhad, Alireza ; Jennings, Joshah ; Weber, Marc H. ; Lynn, Kelvin G.

  • Author_Institution
    Center for Mater. Res., Washington State Univ., Pullman, WA, USA
  • fYear
    2014
  • fDate
    13-16 April 2014
  • Firstpage
    269
  • Lastpage
    274
  • Abstract
    Fabrication of a portable high-density charged particle trap with an array of micro-Penning-Malmberg traps (microtraps) with substantially lower end barrier potentials than conventional Penning-Malmberg traps is presented [1]. The microtraps are designed for antimatter storage such as positrons. The fabrication of large length to radius aspect ratio (1000:1) microtrap arrays involved advanced techniques including photolithography, deep reactive ion etching (DRIE) of silicon wafers to achieve through-vias, gold sputtering of the wafers surfaces and inside the vias, and thermal compression bonding. The bonded stacks were gold electroplated to achieve a uniform gold surface to minimize the patch effects. Positron losses occur in experimentation by trap imperfections such as misalignment of microtraps, asymmetries, and physical imperfections on the surfaces. This paper describes the fabrication issues encountered and addresses geometry errors and asymmetries.
  • Keywords
    lithography; microfabrication; sputter etching; DRIE; antimatter storage; bonded stacks; deep reactive ion etching; geometry errors; gold sputtering; high aspect ratio microtube arrays; high density charged particle trap; microPenning-Malmberg traps; microfabrication; microtraps; patch effect; photolithography; silicon wafers; thermal compression bonding; trap imperfection; wafers surfaces; Adhesives; Etching; Gold; Resists; Silicon; Sputtering; Etching; Lithography; Positrons; Sputtering; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
  • Conference_Location
    Waikiki Beach, HI
  • Type

    conf

  • DOI
    10.1109/NEMS.2014.6908806
  • Filename
    6908806