• DocumentCode
    252778
  • Title

    Package characterization of FET-based biochemical sensors

  • Author

    Voitsekhivska, T. ; Suthau, E. ; Kirsten, S. ; Schubert, M. ; Zorgiebel, F. ; Cuniberti, G. ; Wolter, K.-J.

  • Author_Institution
    Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    725
  • Lastpage
    729
  • Abstract
    In this study we present packaging techniques for SD-card form factor test adapters. Our test adapters consist of FET-based biochemical sensors and a CMOS integrated analog multiplexer connected to a printed circuit board (PCB). Protection of the test adapter is required for long term stability and reliable measurements of the biochemical sensor in a liquid environment. Two different encapsulation techniques and biocompatible materials with different thermo-mechanical properties were used for this purpose. Adhesive strength measurements of these encapsulants on different substrates were carried out. Finally, the package was integrated into a portable measurement system for multiplexed measurements. Measured gate characteristics were compared between blank and packaged test adapters. FET characteristics were measured in dry as well as in liquid environment. Our packaging technique is mechanically stable, suitable for measurements in liquid environments influences neither the electrical characteristics of the FET devices as nor data acquisition.
  • Keywords
    CMOS analogue integrated circuits; biosensors; field effect transistors; integrated circuit packaging; printed circuits; CMOS integrated analog multiplexer; FET-based biochemical sensors; PCB; SD-card form factor test adapters; adhesive strength measurements; biocompatible materials; blank test adapters; encapsulation techniques; liquid environment; multiplexed measurements; package characterization; packaged test adapters; portable measurement system; printed circuit board; thermomechanical properties; Biosensors; Encapsulation; Liquids; Microfluidics; Plastics; Semiconductor device measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/EPTC.2014.7028338
  • Filename
    7028338