Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration

Author

Danqi Zhao ; Xian Huang ; Jun He ; Li Zhang ; Peng Liu ; Fang Yang ; Dacheng Zhang

Author_Institution

Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China

fYear

2014

fDate

13-16 April 2014

Firstpage

513

Lastpage

516

Abstract

In this work, compatible CMOS-MEMS process with surface micromachining is investigated. Surface micromachining method for cantilever fabrication has been merged with conventional CMOS process, and release of MEMS structure is conducted after CMOS process. We designed polysilicon MEMS structures as well as CMOS devices and circuits on a monolithic sensor chip for the investigation of the influence of stress induced by non-adequate post-CMOS annealing. The impact of step coverage and the releasing process on both the MEMS and CMOS components are also discussed.

Keywords

CMOS integrated circuits; micromachining; monolithic integrated circuits; CMOS MEMS process; CMOS devices; cantilever fabrication; monolithic integration; monolithic sensor chip; step coverage; surface micromachining; CMOS integrated circuits; CMOS process; Fabrication; Micromachining; Micromechanical devices; Stress; Surface treatment; MEMS; monolithic integration; post-CMOS;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on

Conference_Location

Waikiki Beach, HI

Type

conf

DOI

10.1109/NEMS.2014.6908861

Filename

6908861