DocumentCode
2530289
Title
Methodology for thermal aware physical design
Author
Kalangi, V.P. ; Kumar, M. Ajay ; Agrawal, Prashant ; Srinivasa, R.S.T. ; Pal, Ajit
Author_Institution
Mobility Group-India, Intel Technol. India (P) Ltd., Bangalore
fYear
2008
fDate
19-21 Nov. 2008
Firstpage
1
Lastpage
4
Abstract
Exponentially increasing power densities in current day designs due to aggressive technology scaling has resulted in temperature being one of the primary design constraint along with others like timing, area and power. Lot of design techniques are being adopted during physical design stage to minimize the power, apart from the architectural techniques like throttling for dynamic thermal management. In this work we propose a practical methodology for better thermal management by floorplan modifications based on thermal hotspots obtained through dynamic simulations, without disturbing the logical connectivity information. This methodology definitely warrants the benefits which can be readily realized by doing this analysis early in the design cycle. This can also improve the placement of the thermal sensors and boost additional performance which can be extracted by their delayed triggering, considering the lateral spreading due to better floorplanning.
Keywords
circuit layout; network synthesis; thermal management (packaging); aggressive technology scaling; delayed triggering; design constraint; dynamic simulations; dynamic thermal management; floorplan modifications; floorplanning; logical connectivity information; physical design stage; power densities; thermal aware physical design; thermal hotspots; thermal sensors; Computer science; Cooling; Design engineering; Energy management; Hardware; Power engineering and energy; Temperature dependence; Thermal engineering; Thermal management; Timing; Floorplanning; Proliferation Designs; Thermal Design Power; Thermal Gradient;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2008 - 2008 IEEE Region 10 Conference
Conference_Location
Hyderabad
Print_ISBN
978-1-4244-2408-5
Electronic_ISBN
978-1-4244-2409-2
Type
conf
DOI
10.1109/TENCON.2008.4766714
Filename
4766714
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