• DocumentCode
    2530289
  • Title

    Methodology for thermal aware physical design

  • Author

    Kalangi, V.P. ; Kumar, M. Ajay ; Agrawal, Prashant ; Srinivasa, R.S.T. ; Pal, Ajit

  • Author_Institution
    Mobility Group-India, Intel Technol. India (P) Ltd., Bangalore
  • fYear
    2008
  • fDate
    19-21 Nov. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Exponentially increasing power densities in current day designs due to aggressive technology scaling has resulted in temperature being one of the primary design constraint along with others like timing, area and power. Lot of design techniques are being adopted during physical design stage to minimize the power, apart from the architectural techniques like throttling for dynamic thermal management. In this work we propose a practical methodology for better thermal management by floorplan modifications based on thermal hotspots obtained through dynamic simulations, without disturbing the logical connectivity information. This methodology definitely warrants the benefits which can be readily realized by doing this analysis early in the design cycle. This can also improve the placement of the thermal sensors and boost additional performance which can be extracted by their delayed triggering, considering the lateral spreading due to better floorplanning.
  • Keywords
    circuit layout; network synthesis; thermal management (packaging); aggressive technology scaling; delayed triggering; design constraint; dynamic simulations; dynamic thermal management; floorplan modifications; floorplanning; logical connectivity information; physical design stage; power densities; thermal aware physical design; thermal hotspots; thermal sensors; Computer science; Cooling; Design engineering; Energy management; Hardware; Power engineering and energy; Temperature dependence; Thermal engineering; Thermal management; Timing; Floorplanning; Proliferation Designs; Thermal Design Power; Thermal Gradient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2008 - 2008 IEEE Region 10 Conference
  • Conference_Location
    Hyderabad
  • Print_ISBN
    978-1-4244-2408-5
  • Electronic_ISBN
    978-1-4244-2409-2
  • Type

    conf

  • DOI
    10.1109/TENCON.2008.4766714
  • Filename
    4766714