DocumentCode
2531264
Title
Signature analysis based IC diagnostics-a statistician´s perspective
Author
Lakshminarayan, Choudur K. ; Pabbisetty, Seshu ; Han, Chien-Pai
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
1997
fDate
21-25 Jul 1997
Firstpage
167
Lastpage
171
Abstract
This paper deals with the basic concepts of signature analysis, and will attempt to demonstrate how its implementation would enable efficient utilization of failure analysis engineering resources to analyze field failures and avoid repetitive analyses. This would accomplish the dual objective of improved customer satisfaction and reduced cycle time. Signature analysis methodology can be used in Failure Analysis, Design, Product, and Customer Quality and Reliability Engineering group applications. Starting with definitions, purpose, and various possible scenarios, a formal mathematical framework is developed for computing sample sizes and establishing confidence levels when the failures occur at random or occur in clusters
Keywords
failure analysis; fault diagnosis; integrated circuit testing; logic testing; statistical analysis; IC diagnostics; confidence levels; customer quality; cycle time; failure analysis engineering resources; field failures; formal mathematical framework; group applications; random failures; reliability engineering; sample sizes; signature analysis; Customer satisfaction; Failure analysis; Instruments; Laboratories; Mathematics; Probability; Product design; Reliability engineering; Throughput; Traffic control;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN
0-7803-3985-1
Type
conf
DOI
10.1109/IPFA.1997.638191
Filename
638191
Link To Document