• DocumentCode
    2531264
  • Title

    Signature analysis based IC diagnostics-a statistician´s perspective

  • Author

    Lakshminarayan, Choudur K. ; Pabbisetty, Seshu ; Han, Chien-Pai

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1997
  • fDate
    21-25 Jul 1997
  • Firstpage
    167
  • Lastpage
    171
  • Abstract
    This paper deals with the basic concepts of signature analysis, and will attempt to demonstrate how its implementation would enable efficient utilization of failure analysis engineering resources to analyze field failures and avoid repetitive analyses. This would accomplish the dual objective of improved customer satisfaction and reduced cycle time. Signature analysis methodology can be used in Failure Analysis, Design, Product, and Customer Quality and Reliability Engineering group applications. Starting with definitions, purpose, and various possible scenarios, a formal mathematical framework is developed for computing sample sizes and establishing confidence levels when the failures occur at random or occur in clusters
  • Keywords
    failure analysis; fault diagnosis; integrated circuit testing; logic testing; statistical analysis; IC diagnostics; confidence levels; customer quality; cycle time; failure analysis engineering resources; field failures; formal mathematical framework; group applications; random failures; reliability engineering; sample sizes; signature analysis; Customer satisfaction; Failure analysis; Instruments; Laboratories; Mathematics; Probability; Product design; Reliability engineering; Throughput; Traffic control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
  • Print_ISBN
    0-7803-3985-1
  • Type

    conf

  • DOI
    10.1109/IPFA.1997.638191
  • Filename
    638191