DocumentCode
2532251
Title
Patterning nanometer resist features on planar & topography substrates using the 2-step NERIME FIB top surface imaging process
Author
Arshak, Khalil ; Gilmartin, Stephen F. ; Collins, Damian ; Korostynska, Olga ; Arshak, Arous
Author_Institution
Limerick Univ., Ireland
fYear
2005
fDate
24-27 July 2005
Firstpage
159
Lastpage
163
Abstract
The 2-step negative resist image by dry etching (2-step NERIME) focused ion beam (FIB) top surface imaging (TSI) process has been previously reported as an excellent technique for patterning nanometer scale features in DNQ/novolak based photoresists on silicon substrates. In this paper we demonstrate that the 2-step NERIME process can be used to pattern nanometer scale resist features on different substrate materials and topography substrates.
Keywords
etching; ion beam effects; nanopatterning; photoresists; surface topography; 2-step negative resist image by dry etching; Si; focused ion beam; patterning nanometer; photoresists; silicon substrates; top surface imaging process; topography substrates; Dry etching; Electron beams; Ion beams; Lithography; Optical films; Optical imaging; Plasma applications; Resists; Substrates; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
MEMS, NANO and Smart Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN
0-7695-2398-6
Type
conf
DOI
10.1109/ICMENS.2005.97
Filename
1540803
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