High reliability silver paste for die bonding

Author

Okabe, Yukihiro ; Kusuhara, Akinobu ; Mizuno, Masuo ; Horiuchi, Koichi

Author_Institution

Sumitomo Bakelite Co. Ltd., Kanagawa, Japan

fYear

1988

fDate

9-11 May 1988

Firstpage

468

Lastpage

472

Abstract

A silver paste for high-reliability die bonding has been developed that meets the requirements of low-stress characteristics, for large chips/copper frames, and of high-moisture resistance, for packages using fine aluminium wiring. The low-stress material was obtained by reducing the elastic modulus of the cured material and by curing at the lowest possible temperature. Low elastic modulus was attained by using the low-molecular phenol-novolac epoxy resin and by decreasing the amount of silver powder used as a filler. The use of the phenol derivative as a curing agent resulted product with a 120 degrees C curing temperature, allowing the chip warping to be reduced to 1/4 of that of the conventional silver paste. The adoption of high-purity epoxy resin also enabled the concentration of chlorine ion to be decreased which lead to the reliability of the same degree as that of the Au-Si eutectic alloy.<>

Keywords

integrated circuit technology; microassembling; packaging; silver; 120 C; Ag paste; Ag powder; Au-Si eutectic alloy; Cl ion concentration; Cu frames; chip warping; cured material; curing temperature; elastic modulus; fine Al wiring; high-reliability die bonding; integrated circuits; low-molecular phenol-novolac epoxy resin; low-stress characteristics; low-stress material; moisture resistance; packaging; Aluminum; Copper; Curing; Epoxy resins; Microassembly; Packaging; Powders; Silver; Temperature; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Components Conference, 1988., Proceedings of the 38th

Conference_Location

Los Angeles, CA, USA

Type

conf

DOI

10.1109/ECC.1988.12634

Filename

12634