• DocumentCode
    2534670
  • Title

    Creep of parylene-C film

  • Author

    Lin, Jeffrey Chun-Hui ; Deng, Peigang ; Lam, Gilbert ; Lu, Bo ; Lee, Yi-Kuen ; Tai, Yu-Chong

  • Author_Institution
    California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2011
  • fDate
    5-9 June 2011
  • Firstpage
    2698
  • Lastpage
    2701
  • Abstract
    The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger´s model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there´s little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes.
  • Keywords
    creep fracture; glass transition; viscoelasticity; Kelvin-Voigt model; Maxwell model; as-deposited parylene-C; creep behavior; dynamic mechanical analysis machine; glass transition temperature; ramping-temperature-dependent modulus experiment; temperature 10 degC; temperature 100 degC; temperature 120 degC; temperature 150 degC; temperature 25 degC; temperature 40 degC; temperature 50 degC; temperature 60 degC; temperature 80 degC; Creep; Glass; Mathematical model; Plastics; Strain; Stress; Temperature measurement; Creep; glass transition temperature; parylene-C; viscoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International
  • Conference_Location
    Beijing
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-0157-3
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2011.5969483
  • Filename
    5969483