Epoxy-less packaging methods for electrical contact to parylene-based flat flexible cables

Author

Gutierrez, Christian A. ; Lee, Curtis ; Kim, Brian ; Meng, Ellis

Author_Institution

Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA

fYear

2011

fDate

5-9 June 2011

Firstpage

2299

Lastpage

2302

Abstract

We present two methods for establishing rapid epoxy-less electrical connectivity to Parylene-based flat flexible cables (FFC). The first utilizes commercially available zero-insertion-force (ZIF) connector technology and the second utilizes a custom-fabricated connector with an acrylic/polydimethylsiloxane (PDMS) interface featuring screen-printed contacts. A contact pitch of 0.5 mm was achieved using both connector methods. These techniques are simple to implement, reversible, scalable and unlike epoxy-based approaches, do not require manual intervention to secure individual contacts.

Keywords

cables (electric); electric connectors; electrical contacts; electronics packaging; PDMS interface; ZIF connector technology; acrylic-polydimethylsiloxane interface; custom-fabricated connector; electrical contact; epoxy-less packaging method; parylene-based flat flexible cable; rapid epoxyless electrical connectivity; screen printed contact; size 0.5 mm; zero insertion force connector technology; Connectors; Contacts; Electrical resistance measurement; Fabrication; Force measurement; Resistance; Silver; Parylene C; flat flexible cable (FFC); screen printing; zero-insertion-force (ZIF);

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International

Conference_Location

Beijing

ISSN

Pending

Print_ISBN

978-1-4577-0157-3

Type

conf

DOI

10.1109/TRANSDUCERS.2011.5969538

Filename

5969538