Polymer MEMS fabrication process for self-assembled millimeter-wave on-chip antennas

A novel micro-electro-mechanical systems (MEMS) fabrication process for self-assembled antennas has been characterized. Self-assembled vertical monopole antennas were previously reported [1]. The vertical on-chip antennas provide higher efficiency over conventional planar on-chip antennas. However, the metallization step of the antennas was performed after the release and self-assembly of the devices resulting in minimal deposition of metal on the backside of the antennas. In the presented work, two separate metallization steps are performed before and after the structural layers are patterned to achieve an even thickness of metal layers on both the top and bottom surfaces of the antennas in order to reduce dielectric loss. Additionally, bridging structures are integrated between the stress-inducing blocks to further enhance self-assembled curvatures with a brief exposure of SU-8.