DocumentCode
2540023
Title
Package Alternatives for Integrated Power Electronic Modules (IPEM) with Improved Voltage Rating
Author
Xu, Jing ; van Wyk, J.D. ; Ngo, Khai
Author_Institution
Center for Power Electronics System (CPES), Virginia Polytechnic Institite and State University, Blacksburg, VA 24060, USA
fYear
2007
fDate
Feb. 25 2007-March 1 2007
Firstpage
416
Lastpage
421
Abstract
The electric field in a baseline Integrated Power Electronic Module (IPEM) as a function of different parameters is evaluated. The electric field distribution inside the embedded insulation material in the IPEM is studied, and several improved structures are discussed. Simulation results suggest that the peak electric field intensity in the embedded insulation material can be reduced by 40%. The blocking capability of the improved structures is not degraded by voids inside the embedded insulation material. The experimental results agree with the simulation results.
Keywords
Degradation; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electronics packaging; Integrated circuit interconnections; Metallization; Power electronics; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference, APEC 2007 - Twenty Second Annual IEEE
Conference_Location
Anaheim, CA, USA
ISSN
1048-2334
Print_ISBN
1-4244-0713-3
Type
conf
DOI
10.1109/APEX.2007.357547
Filename
4195751
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