Multi-element multi-layer packaging for phased array antenna applications

Author

Shalkhauser, K. ; Goetz, M.P. ; Anderson, P.M.

Author_Institution

NASA Lewis Res. Center, Cleveland, OH, USA

fYear

1993

fDate

June 28 1993-July 2 1993

Firstpage

1009

Abstract

The authors describe the design and fabrication of a K/sub a/-band, multilayer, multielement module and present preliminary performance data. This module can be used in advanced phased-array antenna systems. The module makes efficient use of physical volume, and provides reduced interconnect requirements for the array controller. The consolidation of MMIC (monolithic microwave integrated circuit) and ASIC (application-specific integrated circuit) devices into a single package with integral radiating elements has been shown to be feasible. Scattering parameter measurements were made of the module to assess the millimeter-wave performance of the transmission line structures.<>

Keywords

MMIC; S-parameters; antenna phased arrays; application specific integrated circuits; integrated circuit interconnections; integrated circuit packaging; millimetre wave antenna arrays; multichip modules; ASIC; K/sub a/-band; MMIC; application-specific integrated circuit; design; fabrication; integral radiating elements; interconnect requirements; monolithic microwave integrated circuit; multi-layer packaging; multielement module; performance; phased-array antenna systems; scattering parameter measurements; transmission line structures; Antenna arrays; Application specific integrated circuits; Fabrication; Integrated circuit interconnections; MMICs; Microwave devices; Millimeter wave measurements; Nonhomogeneous media; Packaging; Phased arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1993. AP-S. Digest

Conference_Location

Ann Arbor, MI, USA

Print_ISBN

0-7803-1246-5

Type

conf

DOI

10.1109/APS.1993.385178

Filename

385178