• DocumentCode
    2546302
  • Title

    Shelf Packing to the Design and Optimization of A Power-Aware Multi-Frequency Wrapper Architecture for Modular IP Cores

  • Author

    Zhao, Dan ; Chandran, Unni ; Fujiwara, Hideo

  • Author_Institution
    Center for Adv. Comput. Studies, Louisiana at Lafayette Univ., LA
  • fYear
    2007
  • fDate
    23-26 Jan. 2007
  • Firstpage
    714
  • Lastpage
    719
  • Abstract
    This paper proposes a novel power-aware multi-frequency wrapper architecture design to achieve at-speed testability. The trade-offs between power dissipation, scan time and bandwidth are well handled by gating off certain virtual cores at a time while parallelizing the remaining. A shelf packing based optimization algorithm is proposed to design and optimize the wrapper architecture while minimizing the test time under power and bandwidth constraints.
  • Keywords
    design for testability; integrated circuit testing; modular IP cores; optimization algorithm; power dissipation; power-aware multifrequency wrapper architecture; shelf packing; virtual cores; Algorithm design and analysis; Bandwidth; Clocks; Computer architecture; Constraint optimization; Costs; Design optimization; Electronic mail; Frequency; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    1-4244-0629-3
  • Electronic_ISBN
    1-4244-0630-7
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2007.358071
  • Filename
    4196117