DocumentCode
2546302
Title
Shelf Packing to the Design and Optimization of A Power-Aware Multi-Frequency Wrapper Architecture for Modular IP Cores
Author
Zhao, Dan ; Chandran, Unni ; Fujiwara, Hideo
Author_Institution
Center for Adv. Comput. Studies, Louisiana at Lafayette Univ., LA
fYear
2007
fDate
23-26 Jan. 2007
Firstpage
714
Lastpage
719
Abstract
This paper proposes a novel power-aware multi-frequency wrapper architecture design to achieve at-speed testability. The trade-offs between power dissipation, scan time and bandwidth are well handled by gating off certain virtual cores at a time while parallelizing the remaining. A shelf packing based optimization algorithm is proposed to design and optimize the wrapper architecture while minimizing the test time under power and bandwidth constraints.
Keywords
design for testability; integrated circuit testing; modular IP cores; optimization algorithm; power dissipation; power-aware multifrequency wrapper architecture; shelf packing; virtual cores; Algorithm design and analysis; Bandwidth; Clocks; Computer architecture; Constraint optimization; Costs; Design optimization; Electronic mail; Frequency; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2007. ASP-DAC '07. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
1-4244-0629-3
Electronic_ISBN
1-4244-0630-7
Type
conf
DOI
10.1109/ASPDAC.2007.358071
Filename
4196117
Link To Document