An improved SPICE model of phase-change memory (PCM) for peripheral circuits simulation and design

Author

Yiqun Wei ; Xinnan Lin

Author_Institution

Sch. of Electron. & Comput. Eng., Peking Univ., Shenzhen, China

fYear

2014

fDate

10-12 Dec. 2014

Firstpage

132

Lastpage

135

Abstract

An improved SPICE model is presented in this work, including three coupled modules, the electrical module, thermal module and the phase transition dynamic module. Considering the heterogeneous temperature distribution, a temperature distribution model and a distributed resistor network model based on the semispherical hypothesis of the active area are achieved. The model is submitted by Verilog-A language, and the peripheral drive circuit combined with the PCM cell is simulated. The results show a good fit with measurement. According to the simulation, the peripheral circuit for PCM cells with different structure is optimized.

Keywords

SPICE; circuit simulation; driver circuits; hardware description languages; integrated circuit design; integrated circuit modelling; phase change memories; resistors; temperature distribution; PCM cell; Verilog-A language; distributed resistor network model; electrical module; heterogeneous temperature distribution model; improved SPICE model; peripheral drive circuit design; peripheral drive circuit simulation; phase transition dynamic module; phase-change memory; semispherical hypothesis; thermal module; Integrated circuit modeling; Phase change materials; Resistors; SPICE; Temperature measurement; Thermal resistance; Phase-Change Memory; Resistor Network; SPICE Model; nucleation/growth theory;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Circuits (ISIC), 2014 14th International Symposium on

Conference_Location

Singapore

Type

conf

DOI

10.1109/ISICIR.2014.7029548

Filename

7029548