DocumentCode
2548990
Title
The effect of polyimide fixation on thermal performance of GaAs cantilever based MEMS: a 3D numerical analysis with DEETEN
Author
Burian, Eduard ; Lalinsky, Tibor
Author_Institution
LOX Technol., Bratislava, Slovakia
fYear
2002
fDate
14-16 Oct. 2002
Firstpage
13
Lastpage
16
Abstract
We refer of novel simulation technology DEETEN based on spatial domain decomposition, capable of efficient multi-million-point 3D simulations on a conventional PC The technology has been successfully applied to 3D thermal analysis of a GaAs Micromechanical Thermal Converter microsystem.
Keywords
III-V semiconductors; digital simulation; gallium arsenide; micromechanical devices; polymers; thermal analysis; 3D numerical analysis; 3D thermal analysis; GaAs; GaAs Micromechanical Thermal Converter microsystem; GaAs cantilever based MEMS; multi-million-point 3D simulations; novel simulation technology DEETEN; polyimide fixation; spatial domain decomposition; thermal performance; Analytical models; Circuit simulation; Finite difference methods; Gallium arsenide; Integrated circuit technology; Micromechanical devices; Numerical analysis; Polyimides; Thermal decomposition; Thermal engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices and Microsystems, 2002. The Fourth International Conference on
Print_ISBN
0-7803-7276-X
Type
conf
DOI
10.1109/ASDAM.2002.1088464
Filename
1088464
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