• DocumentCode
    2550710
  • Title

    Low-loss and low-cost solution for printed transmission lines at millimeter-wavelengths by using bilaterally metal-loaded tri-plate transmission line

  • Author

    Kuroki, Futoshi ; Tamaru, Ryo-ji

  • Author_Institution
    Kure Nat. Coll. of Technol., Kure, Japan
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    301
  • Lastpage
    304
  • Abstract
    Since surfaces of dielectric substrates for printed boards are usually roughened to make tight copper-coating, it was found out that an effective conductivity of a surface of the copper foil, attaching on the dielectric substrate, more degraded than that of an opposite surface of the copper foil, facing an air region, beyond centimeter frequencies. The transmission loss therefore degrades due to the roughness of the copper foil surface. On the other side, it is confirmed that the current density on the under surface of the copper foil decreases by symmetrically-loading metal patterns on both sides of the dielectric substrate and by biasing an equi-voltage to both metal patterns, and thus the transmission loss is relatively unaffected by the roughness of the dielectric surfaces. Based on this consideration, a bi-laterally metal-loaded tri-plate transmission line was evaluated by using a cheap FR-4 substrate, being poor material for use as millimeter-wave lengths but being cost-effective.
  • Keywords
    Q-factor; millimetre wave devices; parallel plate waveguides; printed circuits; surface roughness; Q-factor; bilaterally metal-loaded triplate transmission line; copper foil surface; current density; dielectric substrates; millimeter-wavelength; parallel metal plate waveguide; printed board; printed transmission lines; symmetrically-loading metal pattern; transmission loss; Conductivity; Copper; Degradation; Dielectric losses; Dielectric substrates; Joining processes; Propagation losses; Rough surfaces; Surface roughness; Transmission lines; Low transmission loss; Printed transmission line; microwaves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165693
  • Filename
    5165693