DocumentCode
2553629
Title
Design and simulation of a high temperature MEMS micro-hotplate for application in trace gas detection
Author
Ahmed, Abdelaziz Yousif ; Dennis, John Ojur ; Saad, Mohamad Naufal Mohamad ; Talah, Waddah Abdelbagi
Author_Institution
Electr.&Electron. Dept., Univ. Teknol. Petronas, Tronoh
fYear
2008
fDate
25-27 Nov. 2008
Firstpage
153
Lastpage
157
Abstract
In this paper, we present the simulation results of a high temperature MEMS micro-hotplate. The electro-thermo-mechanical behaviors of micro- hotplates (MHP) have been simulated using CoventorWare. In the simulation, the effects of various thicknesses of the silicon nitride (Si3N4) membrane layer on the temperature, mechanical deflection and power consumption of the MHP are evaluated. The effect of the addition of a layer of silicon carbide (SiC) on the MHP temperature distribution is also investigated. Results show that as the thickness of the Si3N4 membrane is increased from 0.3 mum to 3 mum, the power consumption of the MHP increases from 7.1 mW to 34.3 mW while the displacement of the membrane remains constant at a value of about 5.8 mum. It is also demonstrated that when the MHP is designed with a silicon carbide (SiC) heat distributing layer above the silicon oxide (SiO2) insulating layer on top of the heater, the uniformity of the temperature on the MHP membrane is considerably improved as compared to a membrane without SiC.
Keywords
membranes; micromechanical devices; silicon compounds; CoventorWare; MEMS; Si3N4-SiC-SiO2; electro-thermo-mechanical behaviors; mechanical deflection; microhotplate; power 7.1 mW to 34.3 mW; power consumption; silicon carbide heat distributing layer; silicon nitride membrane layer; silicon oxide insulating layer; size 0.3 mum to 3 mum; Arm; Biomembranes; Dielectric materials; Energy consumption; Insulation; Mechanical systems; Micromechanical devices; Silicon carbide; Temperature distribution; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2008. ICSE 2008. IEEE International Conference on
Conference_Location
Johor Bahru
Print_ISBN
978-1-4244-3873-0
Electronic_ISBN
978-1-4244-2561-7
Type
conf
DOI
10.1109/SMELEC.2008.4770297
Filename
4770297
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