• DocumentCode
    2555024
  • Title

    3D MMIC compact semi-lumped loaded CPW stubs for spurious suppression fabricated with a standard air bridge process

  • Author

    Hettak, K. ; Elgaid, K. ; Thayne, I.G. ; Morin, G.A. ; Stubbs, M.G.

  • Author_Institution
    Commun. Res. Centre Canada, Ottawa, ON, Canada
  • fYear
    2009
  • fDate
    7-12 June 2009
  • Firstpage
    1033
  • Lastpage
    1036
  • Abstract
    Compact and harmonic suppression semi-lumped stubs based on a CPW/thin film microstrip combination using 3D on-chip air-core solenoid and elevated symmetric inductors are proposed. The stubs are implemented using an MMIC airbridge process to realize an elevated transmission line and 3D inductors. These 3D inductors are used to load open circuit CPW/TFMS stubs in order to reduce their sizes. In addition to size reduction, an excellent suppression of spurious harmonic responses are achieved with improved dielectric loss which are inherent in these types of semi-lumped stubs. The experimental results presented in this paper demonstrate the validity of the design method.
  • Keywords
    MMIC; coplanar waveguides; dielectric losses; inductors; microstrip circuits; thin film circuits; 3D inductors; 3D monolithic microwave integrated circuits; 3D on-chip air-core solenoid; compact semilumped loaded CPW stubs; dielectric loss; elevated symmetric inductors; elevated transmission line; harmonic suppression semilumped stubs; spurious suppression; standard air bridge process; thin film microstrip combination; Bridge circuits; Coplanar waveguides; Dielectric losses; Distributed parameter circuits; Harmonics suppression; MMICs; Microstrip; Solenoids; Thin film circuits; Thin film inductors; 3D air -core Solenoid inductor; CPW stubs; Elevated symmetric inductor; TFMS; spurious suppression;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2009. MTT '09. IEEE MTT-S International
  • Conference_Location
    Boston, MA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-2803-8
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2009.5165876
  • Filename
    5165876