• DocumentCode
    2560009
  • Title

    A 21.6μW inductively powered implantable IC for blood flow measurement

  • Author

    Khannur, Pradeep Basappa ; Chan, Kok Lim ; Cheong, Jia Hao ; Kang, Kai ; Lee, Andreas Astuti ; Liu, Xin ; Lim, Huey Jen ; Ramakrishna, Kotlanka ; Je, Minkyu

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Nov. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a fully integrated inductively powered implantable circuits for blood flow measurement, which are embedded within vascular prosthetic grafts for early detection of graft degradation or failure. The ASIC interfaces with micro-fabricated pressure sensors and uses a 13.56MHz carrier frequency for power transfer and command/data communication. A backscatter-modulated passive telemetry is used for transmitting sensor readout information to an external monitoring device. The chip has been fabricated in 0.18μm CMOS process, occupies a total active area of 1.5×1.78mm2 and consumes a total power of 21.6μW. The rectifier achieves an efficiency of 66% The sub-μW 10-bit SAR ADC achieves an ENOB of 8.5 bits at 106KS/s conversion rate.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; biomedical telemetry; blood flow measurement; lab-on-a-chip; prosthetic power supplies; rectifiers; ASIC; CMOS process; backscatter-modulated passive telemetry; blood flow measurement; command communication; data communication; external monitoring device; frequency 13.56 MHz; graft degradation; inductively powered implantable IC; microfabricated pressure sensors; power 21.6 muW; power transfer; rectifier; sensor readout information; vascular prosthetic grafts; Application specific integrated circuits; Blood flow; Clocks; Prosthetics; Rectifiers; Sensors; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Circuits Conference (A-SSCC), 2010 IEEE Asian
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-8300-6
  • Type

    conf

  • DOI
    10.1109/ASSCC.2010.5716602
  • Filename
    5716602