• DocumentCode
    2561007
  • Title

    Infrared imaging in diabetic foot ulceration

  • Author

    Harding, J.R. ; Wertheim, D.F. ; William, R.J. ; Melhuish, J.M. ; Banerjee, D. ; Harding, K.G.

  • Author_Institution
    Dept. of Clinical Radiol., St. Woolos Hosp., Newport, UK
  • Volume
    2
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    916
  • Abstract
    Diabetic foot ulcers present a difficult problem in clinical management because of increased risk of soft-tissue infection in diabetes plus impaired local blood supply due to diabetic vascular disease. Infection of diabetic foot ulcers has particular risk of involvement of the adjacent bone resulting in the serious complication of osteomyelitis. This needs early aggressive antibiotic therapy to avoid even more serious secondary long-term complications, but unfortunately clinical diagnosis and radiological examination may be unhelpful in early osteomyelitis, when antibiotic therapy is most effective. Furthermore the large number of patients plus the chronic nature of diabetic foot ulceration precludes routine investigation for early osteomyelitis by X-ray or isotope bone scanning in every case, for logistic, radiation protection, and cost reasons. This preliminary study has shown significantly increased temperature on infrared imaging, not only around the ulcer, but in the entire foot in patients subsequently confirmed radiologically as having early osteomyelitis
  • Keywords
    biomedical imaging; diseases; infrared imaging; adjacent bone involvement; antibiotic therapy; diabetic foot ulceration; diabetic vascular disease; early aggressive antibiotic therapy; impaired local blood supply; medical diagnostic imaging; osteomyelitis; soft-tissue infection risk; thermal imaging; thermography; Antibiotics; Blood; Bone diseases; Clinical diagnosis; Diabetes; Foot; Infrared imaging; Medical treatment; Risk management; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.745591
  • Filename
    745591