DocumentCode
2562245
Title
Effect of solder joint geometry on the predicted fatigue life of BGA solder joints
Author
Holub, Ira R. ; Pitarresi, James M. ; Singler, Timothy J.
Author_Institution
Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1996
fDate
29 May-1 Jun 1996
Firstpage
187
Lastpage
194
Abstract
A general computational approach to determine the effect of solder joint shape on the fatigue life is presented. Using the integrated matrix creep failure metric, a number of cases are considered wherein the solder volume, standoff height, or both, are varied and the joint life computed. Both volumetric and interface averaging of the matrix creep are considered. For non-mask defined pads, the greater the solder volume, the higher the life; for mask defined pads, the reverse trend was observed
Keywords
fatigue; packaging; soldering; BGA solder joint; fatigue life; interface averaging; mask defined pad; matrix creep failure metric; nonmask defined pad; volumetric averaging; Assembly; Ceramics; Creep; Fatigue; Geometry; Mechanical engineering; Packaging; Shape; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location
Orlando, FL
Print_ISBN
0-7803-3325-X
Type
conf
DOI
10.1109/ITHERM.1996.534561
Filename
534561
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