Simulation of plasma treatment of uneven substrates in magnetic field

Plasma-assisted technologies are widely used techniques for material treatment. The unevenness of treated substrates can cause problems in case when the active particles in plasma do not reach the whole surface. The presence of external magnetic field changes the behavior of plasma and therefore, the efficiency of the treatment can alter too. Besides the magnetic field, the motion of charged particles is influenced by several other factors as plasma pressure, substrate bias, etc. The theoretical prediction of the treating process is difficult especially when the active plasma species are reactive. Such problems can be effectively analyzed by computer simulations. Despite of their time requirements, the particle models provide us with the most detailed output information including particle fluxes to the substrate, their energy and angular distributions, spatial distributions of electrostatic potential, number densities of charged species, etc.