DocumentCode
2563830
Title
[Front cover]
fYear
2012
fDate
25-27 April 2012
Abstract
The following topics are dealt with: microfabrication techniques; microfluidics; assembly; wireless networked green sensor system; numerical modelling; optoelectronics; RF MEMS transducers; and RF MEMS resonators.
Keywords
assembling; microfabrication; micromechanical devices; numerical analysis; optoelectronic devices; packaging; resonators; transducers; wireless sensor networks; MEMS; RF MEMS resonators; RF MEMS transducers; assembly; microfabrication techniques; microfluidics; numerical modelling; optoelectronics; wireless networked green sensor system;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location
Cannes
Print_ISBN
978-1-4673-0785-7
Type
conf
Filename
6235289
Link To Document