DocumentCode
2564069
Title
Effective implementation of cycle time reduction strategies for semiconductor back-end manufacturing
Author
Domaschke, Joerg ; Brown, Steven ; Robinson, Jennifer ; Leibl, Franz
Author_Institution
Siemens AG, Munich, Germany
Volume
2
fYear
1998
fDate
13-16 Dec 1998
Firstpage
985
Abstract
Using discrete event simulation models, a study was conducted to evaluate the current production practices of a high volume semiconductor back-end operation. The overall goal was to find potential areas for productivity improvement that would collectively yield a 60% reduction in manufacturing cycle time. The paper presents the simulation methodology and findings pertaining to analysis of the Assembly, Burn-In, and Test operations. Many of the recommendations identified can be implemented at no additional cost to the factory. The most significant opportunities for improvement are in the Test area, the system constraint. Additionally, the model is extremely sensitive to changes in operator staffing levels, an accurate reflection of many back-end operations. The model shows that the cumulative impact of these recommendations is a 41% reduction in average cycle time, a significant contribution to the overall goal
Keywords
discrete event simulation; personnel; production control; semiconductor device manufacture; Test operations; average cycle time; back-end operations; cycle time reduction strategies; discrete event simulation models; factory; high volume semiconductor back-end operation; manufacturing cycle time; operator staffing levels; production practices; productivity improvement; semiconductor back-end manufacturing; simulation methodology; system constraint; Analytical models; Assembly; Flow production systems; Performance analysis; Predictive models; Production facilities; Productivity; Semiconductor device manufacture; Semiconductor device modeling; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference Proceedings, 1998. Winter
Conference_Location
Washington, DC
Print_ISBN
0-7803-5133-9
Type
conf
DOI
10.1109/WSC.1998.745803
Filename
745803
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