Preparation and dielectric properties of epoxy - BN and epoxy - AlN nanocomposites

Author

Kochetov, R. ; Andritsch, T. ; Lafont, U. ; Morshuis, P.H.F. ; Picken, S.J. ; Smit, J.J.

Author_Institution

Delft Univ. of Technol., Delft, Netherlands

fYear

2009

fDate

May 31 2009-June 3 2009

Firstpage

397

Lastpage

400

Abstract

The dielectric properties of nanocomposites composed of epoxy resin host and aluminum nitride (AlN) and boron nitride (BN) nanofillers have been studied in the frequency domain from 10^-2 to 10⁶ Hz at different temperatures. The introduction of the ceramic AlN and BN nanoparticles into the epoxy resin is described step by step. To improve the dispersion of the filler in the organic polymer matrix and make the nanoparticles compatible with the host material, a silane coupling agent (SCA) has been used for surface modification. The complex permittivity of AlN-epoxy and BN-epoxy composites has been investigated as a function of filler content.

Keywords

aluminium compounds; boron compounds; epoxy insulation; filled polymers; nanocomposites; nanoparticles; permittivity; AlN; BN; aluminum nitride; boron nitride nanofiller; dielectric property; epoxy resin host; nanocomposites; nanoparticles; organic polymer matrix; permittivity; silane coupling agent; Aluminum nitride; Boron; Ceramics; Dielectrics; Epoxy resins; Frequency domain analysis; Nanocomposites; Nanoparticles; Polymers; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation Conference, 2009. EIC 2009. IEEE

Conference_Location

Montreal, QC

Print_ISBN

978-1-4244-3915-7

Electronic_ISBN

978-1-4244-3917-1

Type

conf

DOI

10.1109/EIC.2009.5166378

Filename

5166378