DocumentCode
2570717
Title
Power Distribution Measurements of the Dual Core PowerPC/sup TM/ 970MP Microprocessor
Author
Hamann, Hendrik F. ; Weger, Alan ; Lacey, James ; Cohen, Erwin ; Atherton, Craig
Author_Institution
IBM, Yorktown Heights, NY
fYear
2006
fDate
6-9 Feb. 2006
Firstpage
2172
Lastpage
2179
Abstract
Spatially-resolved imaging of microprocessor power (SIMP) is shown to be a critical tool for measuring temperature and power distributions of a microprocessor under full operating conditions. In this paper, the SIMP technique is applied to the dual-core PowerPCtrade 970MP microprocessor
Keywords
microprocessor chips; power measurement; temperature measurement; dual core PowerPC 970MP microprocessor; power distribution measurements; spatially-resolved imaging microprocessor power; temperature measurement; Cooling; Electrical resistance measurement; Microprocessors; Power distribution; Power measurement; Semiconductor device measurement; Spatial resolution; Temperature distribution; Temperature measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
1-4244-0079-1
Type
conf
DOI
10.1109/ISSCC.2006.1696278
Filename
1696278
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