Packaged MEMS tunable resonators

Author

Pothier, A. ; Blondy, P. ; Cros, D. ; Verdeyme, S. ; Guillon, P. ; Champeaux, C. ; Tristant, P. ; Catherinot, A.

Author_Institution

IRCOM, Limoges Univ., France

Volume

1

fYear

2002

fDate

2002

Firstpage

33

Abstract

In this paper, basic resonators including MEMS variable capacitor types are presented. MEMS structures allow tuning of the cell center frequency and input-output coupling. To improve the tunable resonator quality factor, the circuit is packaged using bulk micromachining techniques. MEMS varactors are associated in a parallel configuration to improve their quality factor. At 27 GHz, a semi-lumped resonator with a quality factor of 130 has been fabricated. MEMS varactors are not decoupled from the resonator to improve the Q, as it is usually done with low-Q semiconductor diodes.

Keywords

Q-factor; micromachining; micromechanical resonators; microwave devices; millimetre wave devices; packaging; tuning; varactors; 27 GHz; MEMS packaged tunable microwave resonators; MEMS structures; Q factor; bulk micromachining; cell center frequency tuning; input-output coupling; low Q semiconductor diodes; mm-wave resonators; parallel configured MEMS varactors; resonator quality factor; semi-lumped resonators; varactor decoupling; variable capacitors; Capacitors; Circuit optimization; Coupling circuits; Frequency; Micromechanical devices; Packaging; Q factor; Tunable circuits and devices; Tuning; Varactors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2002. CAS 2002 Proceedings. International

Print_ISBN

0-7803-7440-1

Type

conf

DOI

10.1109/SMICND.2002.1105795

Filename

1105795