• DocumentCode
    2571300
  • Title

    Modeling of temperature characteristics for metal-ferroelectric-insulator-semiconductor devices

  • Author

    Tang, J.X. ; Tang, M.H. ; Yang, F. ; Zhang, J.J. ; Zhou, Y.C. ; Zheng, X.J.

  • Author_Institution
    Xiangtan Univ., Hunan
  • fYear
    2007
  • fDate
    22-25 Oct. 2007
  • Firstpage
    1050
  • Lastpage
    1053
  • Abstract
    Modeling of temperature characteristics for metal-ferroelectric-insulator-semiconductor devices is given in detail in this paper. Based on the Miller model, the polarization, the electric field in ferroelectric layer, surface potential, and drain-to-source current with gate voltage are investigated over a wide temperature range from 300 K to 600 K. From the model results, for the first time, we find that the semiconductor substrate can lead to the ferroelectric imprint under different temperatures, and there exists a zero-temperature-coefficient bias point in the transfer characteristic curves as conventional metal-oxide-semiconductor devices.
  • Keywords
    electron mobility; ferroelectric devices; insulated gate field effect transistors; surface potential; temperature distribution; MFIS-FET devices; Miller model; drain-to-source current; electron mobility; ferroelectric imprint; ferroelectric layer; ferroelectric-gate field effect transistor; metal-ferroelectric-insulator-semiconductor devices; semiconductor substrate; surface potential; temperature 300 K to 600 K; temperature characteristics; transfer characteristic curves; zero-temperature-coefficient bias point; Electron mobility; Ferroelectric materials; Inorganic materials; Magnetic field induced strain; Optical scattering; Rough surfaces; Substrates; Surface roughness; Temperature dependence; Voltage; MFIS-FET; Temperature; ZTC point;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC, 2007. ASICON '07. 7th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4244-1132-0
  • Electronic_ISBN
    978-1-4244-1132-0
  • Type

    conf

  • DOI
    10.1109/ICASIC.2007.4415813
  • Filename
    4415813