DocumentCode
2572643
Title
A novel 6T-SRAM cell technology designed with rectangular patterns scalable beyond 0.18 /spl mu/m generation and desirable for ultra high speed operation
Author
Ishida, M. ; Kawakami, T. ; Tsuji, A. ; Kawamoto, N. ; Motoyoshi, M. ; Ouchi, N.
Author_Institution
Syst. LSI Div., Sony Corp., Atsugi, Japan
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
201
Lastpage
204
Abstract
A novel 6T-SRAM cell layout designed with rectangular patterns has been developed. Employing this layout, 4.13 /spl mu/m/sup 2/ and 5.33 /spl mu/m/sup 2/ cells with word transistor width of 0.25 /spl mu/m and 0.75 /spl mu/m are obtained, respectively, based on the 0.20 /spl mu/m rule. Among the various layouts of 6T-SRAM cells, this layout provides minimum cell size and the smallest bit line capacitance with word transistor width over 0.75 /spl mu/m for the ultra high speed operation. It is also demonstrated quantitatively that the optimized SRAM cell layout for high speed use is different from that for low power use. The cell layout proposed also provides the excellent scalability beyond 0.18 /spl mu/m generation due to its highly simplified pattern design.
Keywords
SRAM chips; high-speed integrated circuits; integrated circuit layout; integrated circuit technology; 0.18 micron; 6T-SRAM cell technology; bit line capacitance; design; layout; rectangular pattern; scalability; ultra high speed operation; word transistor size; Capacitance; Central Processing Unit; Circuits; Decoding; Delay; Large scale integration; Lithography; Random access memory; Scalability; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746322
Filename
746322
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