DocumentCode
2573861
Title
Beyond TED: understanding boron shallow junction formation
Author
Dunham, S.T. ; Chakravarthi, S. ; Gencer, A.H.
Author_Institution
Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
501
Lastpage
504
Abstract
As implant energies are reduced with the aim of forming shallower junctions, transient enhanced diffusion (TED) effects are greatly reduced. With TED less pronounced, other effects emerge to dominate the diffusion of dopants such as boron. In particular, coupled dopant/defect diffusion injects interstitials leading to enhanced tail diffusion, while oxidation and the diffusion of silicon through thin oxides affects the surface point defect concentrations. This paper shows that by careful consideration of models developed for much deeper junctions, the dependence of junction depth on processing conditions can be understood for shallow junctions as well.
Keywords
VLSI; boron; diffusion; doping profiles; elemental semiconductors; interstitials; ion implantation; oxidation; silicon; Si:B; coupled dopant/defect diffusion; dopant diffusion; implant energies; interstitials; junction depth; oxidation; processing conditions; shallow junction formation; surface point defect concentrations; tail diffusion; Boron; Computer aided manufacturing; Implants; Lead compounds; Oxidation; Semiconductor process modeling; Silicon; Tail; Temperature; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746407
Filename
746407
Link To Document