• DocumentCode
    2573861
  • Title

    Beyond TED: understanding boron shallow junction formation

  • Author

    Dunham, S.T. ; Chakravarthi, S. ; Gencer, A.H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    501
  • Lastpage
    504
  • Abstract
    As implant energies are reduced with the aim of forming shallower junctions, transient enhanced diffusion (TED) effects are greatly reduced. With TED less pronounced, other effects emerge to dominate the diffusion of dopants such as boron. In particular, coupled dopant/defect diffusion injects interstitials leading to enhanced tail diffusion, while oxidation and the diffusion of silicon through thin oxides affects the surface point defect concentrations. This paper shows that by careful consideration of models developed for much deeper junctions, the dependence of junction depth on processing conditions can be understood for shallow junctions as well.
  • Keywords
    VLSI; boron; diffusion; doping profiles; elemental semiconductors; interstitials; ion implantation; oxidation; silicon; Si:B; coupled dopant/defect diffusion; dopant diffusion; implant energies; interstitials; junction depth; oxidation; processing conditions; shallow junction formation; surface point defect concentrations; tail diffusion; Boron; Computer aided manufacturing; Implants; Lead compounds; Oxidation; Semiconductor process modeling; Silicon; Tail; Temperature; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746407
  • Filename
    746407