• DocumentCode
    2573917
  • Title

    Monte Carlo simulation of ion implantation into topographically complex structures

  • Author

    Obradovic, B.J. ; Balamurugan, G. ; Wang, G. ; Chen, Y. ; Tasch, A.F.

  • Author_Institution
    Microelectron. Res. Center, Texas Univ., Austin, TX, USA
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    513
  • Lastpage
    516
  • Abstract
    A new physically based Monte Carlo ion implantation simulator has been developed and implemented in UT-MARLOWE. The new simulator is capable of simulating 2-D and 3-D implants into arbitrary topography with multiple layers, both crystalline and amorphous. Emphasis has been placed on computational efficiency, and improvements over previous simulators ranging from 1-3 orders of magnitude in CPU time have been observed. The accuracy of the simulation is observed not to be compromised by the algorithms for improved computational efficiency.
  • Keywords
    Monte Carlo methods; ion implantation; semiconductor process modelling; Monte Carlo simulation; UT-MARLOWE; algorithm; computational efficiency; ion implantation; topographical structure; Analytical models; Computational efficiency; Computational modeling; Geometry; Implants; Ion implantation; Monte Carlo methods; Semiconductor process modeling; Solid modeling; Surfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746410
  • Filename
    746410