DocumentCode
2573917
Title
Monte Carlo simulation of ion implantation into topographically complex structures
Author
Obradovic, B.J. ; Balamurugan, G. ; Wang, G. ; Chen, Y. ; Tasch, A.F.
Author_Institution
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
fYear
1998
fDate
6-9 Dec. 1998
Firstpage
513
Lastpage
516
Abstract
A new physically based Monte Carlo ion implantation simulator has been developed and implemented in UT-MARLOWE. The new simulator is capable of simulating 2-D and 3-D implants into arbitrary topography with multiple layers, both crystalline and amorphous. Emphasis has been placed on computational efficiency, and improvements over previous simulators ranging from 1-3 orders of magnitude in CPU time have been observed. The accuracy of the simulation is observed not to be compromised by the algorithms for improved computational efficiency.
Keywords
Monte Carlo methods; ion implantation; semiconductor process modelling; Monte Carlo simulation; UT-MARLOWE; algorithm; computational efficiency; ion implantation; topographical structure; Analytical models; Computational efficiency; Computational modeling; Geometry; Implants; Ion implantation; Monte Carlo methods; Semiconductor process modeling; Solid modeling; Surfaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-4774-9
Type
conf
DOI
10.1109/IEDM.1998.746410
Filename
746410
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