DocumentCode

2575455

Title

Power Supply Noise Analysis Methodology For Deep-submicron Vlsi Chip Design

Author

Chen, Howard H. ; Ling, David D.

Author_Institution

IBM Research Division Thomas J. Watson Research Center Yorktown Heights, NY 10598, U.S.A

fYear

1997

fDate

9-13 June 1997

Firstpage

638

Lastpage

643

Keywords

Artificial intelligence; Capacitors; Chip scale packaging; Circuit noise; Degradation; Impedance; Noise reduction; Power supplies; Very large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 1997. Proceedings of the 34th

Conference_Location

Anaheim, CA, USA

ISSN

0738-100X

Print_ISBN

0-7803-4093-0

Type

conf

DOI

10.1109/DAC.1997.597223

Filename

597223