An Upside-down Soldering Technique for MCM House Sealing

Author

Xie, Qilin

Author_Institution

No.38 Inst. of China Electr.s Technol. Group Corp., Anhui

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

This paper puts forward an upside-down soldering technique for MCM house hermetic sealing with his lid. the MCM house was taken upside-down, with his lid and solder film loop grouped in advance, let the lid attach with the hot platform, then heated it to finish soldering for hermetic sealing clamps used and appropriate structure form design and optimized technical parameters to ensure the temperature on the bottom of MCM house was lower than the melting point by 30degC of solder metal attached to house. After some testing, the MCM´s electricity performance has no distinct change. This technique is very simple and credible, and it´s relatively easy to remove the lid and to solder at repairing

Keywords

clamps; hermetic seals; multichip modules; soldering; MCM electricity performance; MCM house sealing; clamps; lid attach; solder film; solder metal; upside-down soldering technique; Clamps; Design optimization; Electronic equipment; Glass; Inorganic materials; Packaging; Soldering; Surface finishing; Temperature control; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359744

Filename

4198865