DocumentCode
2576463
Title
Equipment grounding conductors and bonding: a vital link in electrical system protection
Author
Ockuly, George J.
Author_Institution
Bussman Cooper Ind., St. Louis, MO, USA
fYear
1989
fDate
10-11 Apr 1989
Firstpage
56
Lastpage
60
Abstract
Electrical equipment grounding and bonding conductors must be sized to withstand the maximum fault currents imposed during abnormal system conditions. It is noted that many low-voltage distribution systems do not contain adequately sized equipment grounding conductors and bonding jumpers, compromising personnel and system safety. It is emphasized that proper consideration of conductor withstand ratings provides improved equipment grounding, system reliability, and safety. Examples are presented which illustrate the engineering and design issues associated with proper selection and sizing of the equipment grounding conductor and associated bonding conductors. Particular consideration is given to insulated conductor withstand ratings, bare conductor withstand ratings, and conductor sizing using a current-limiting device. It is concluded that it is the responsibility of the design engineer to comply with the National Electrical Code requirements as well as to understand the nuances of proper electrical protection associated with component and equipment withstandability
Keywords
conductors (electric); earthing; power system protection; safety; standards; LV distribution systems; National Electrical Code; abnormal system conditions; bare conductor withstand ratings; bonding conductors; bonding jumpers; conductor sizing; current-limiting device; electrical system protection; grounding conductors; insulated conductor withstand ratings; maximum fault currents; personnel safety; reliability; system safety; Bonding; Conductors; Design engineering; Fault currents; Grounding; Insulation; Personnel; Protection; Reliability engineering; Safety devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering Problems in the Rubber and Plastics Industries, 1989., IEEE Conference Record of 1989 Forty-First Annual Conference of
Conference_Location
Akron, OH
Type
conf
DOI
10.1109/RAPCON.1989.47716
Filename
47716
Link To Document