• DocumentCode
    2576483
  • Title

    Pb-free Solder: SAC105 vs SAC305 Drop-Test Reliability Data Comparison

  • Author

    Iyer, Ganesh ; Ouyang, Eric ; Kittidacha, Witoon ; Tantideeravit, Soratos ; Suresh, L.K.

  • Author_Institution
    Spansion lnc., Sunnyvale, CA
  • fYear
    2007
  • fDate
    3-5 Oct. 2007
  • Firstpage
    251
  • Lastpage
    255
  • Abstract
    With Pb-free RoHS compliance already in place and with the limited reliability data available for the Pb-free solder, it is becoming very difficult for industry to find a suitable replacement for the Sn-Pb system. There is an increasing market for mobile and hand held applications, but with limited data on the reliability tests like drop test it is becoming a inventory fiasco for the companies to deal with different Pb-free solders to cater a particular application. This paper is an effort to gather experimental data (drop test) for the two popular Pb-free solders SAC 105 and SAC 305 and compare its failure mechanism and co-relate it with a numerical simulation. It concludes with a recommendation for a common Pb-free solder as a plausible replacement to the existing Sn-Pb system for hand held and mobile applications.
  • Keywords
    copper alloys; lead alloys; numerical analysis; silver alloys; solders; tin alloys; Sn-Ag-Cu; Sn-Pb; hand held applications; mobile applications; numerical simulation; reliability tests; solders; Electronic equipment testing; Electronics packaging; Environmentally friendly manufacturing techniques; Failure analysis; Integrated circuit interconnections; Lead; Semiconductor device packaging; Semiconductor device testing; Stress; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
  • Conference_Location
    San Jose, CA
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-1335-5
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2007.4417072
  • Filename
    4417072