Dendritic materials as a dry release sacrificial layer

Author

Suh, H. ; Bharathi, P. ; Moore, J. ; Beebe, D.J.

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

fYear

1999

fDate

21-21 Jan. 1999

Firstpage

200

Lastpage

204

Abstract

This paper presents a novel dry release process using a highly structured dendritic material as a sacrificial layer. A specific dendritic material under study, known as HB560, has been characterized and integrated into standard Microelectromechanical Systems processing. An array of electroplated nickel cantilever beams 100 /spl mu/m/spl times/100 /spl mu/m-1000 /spl mu/m in length has been successfully fabricated and dry released. The required release time is 10 minutes at 650/spl deg/C in O/sub 2/. A photosensitive version of the dendritic material has also been synthesized and characterized.

Keywords

dendritic structure; micromechanical devices; 650 C; HB560; MEMS fabrication; Ni; dendritic material; dry release; electroplated nickel cantilever beam array; hyperbranched polymer; photosensitivity; sacrificial layer; Adhesives; Dry etching; Fabrication; Microelectromechanical systems; Micromechanical devices; Microstructure; Oxidation; Plasma temperature; Polymers; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on

Conference_Location

Orlando, FL, USA

ISSN

1084-6999

Print_ISBN

0-7803-5194-0

Type

conf

DOI

10.1109/MEMSYS.1999.746808

Filename

746808