Plasma resistance and behavior of polybenzoxazine polymer

Author

Jem-Kun Chen ; I-Kuang Lin ; Fu-Hsiang Ko ; Feng-Chih Chang ; Kuo-Shen Chen

Author_Institution

Nat. Nano Device Lab., Hsinchu, Taiwan

fYear

2003

fDate

29-31 Oct. 2003

Firstpage

260

Lastpage

261

Abstract

The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.

Keywords

curing; glass transition; plasma materials processing; polymer films; thermal stability; IC manufacturing; absorption; catalyst; condensation; glass transition; heterocyclic ring; plasma resistance; polybenzoxazine structure; thermal self-curing; thermal stability; Absorption; Curing; Glass; Joining processes; Plasma properties; Plasma temperature; Polymers; Resins; Thermal stability; Water;

fLanguage

English

Publisher

ieee

Conference_Titel

Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International

Conference_Location

Tokyo, Japan

Print_ISBN

4-89114-040-2

Type

conf

DOI

10.1109/IMNC.2003.1268745

Filename

1268745