Bonding wire loop antenna built into standard BGA package for 60 GHz short-range wireless communication

The unlicensed 60 GHz frequency band is suitable for high-speed wireless systems with transmission rates of 1 Gbps or more. In this paper, we propose a bonding wire antenna built into a BGA package for 60 GHz short-range wireless communication. This antenna utilizes two bonding wires and a metal plate on an interposer in a BGA package and has a loop shape. The proposed antenna is built into a standard BGA package without special modification, so that it can be fabricated at low cost by conventional BGA package fabrication process. The first and unique evaluation of the antenna fully sealed by encapsulation resin was done by measurement. We describe the operation mechanism of the proposed antenna, the design procedure and the measurement results.