Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

Author

Sun, Wei ; Zhu, W.H. ; Danny, Retuta ; Che, F.X. ; Wang, C.K. ; Sun, Anthony Y S ; Tan, H.B.

Author_Institution

Packaging Anal. & Design Center, United Test & Assembly Center Ltd. (UTAC), Singapore

fYear

2007

fDate

16-18 April 2007

Firstpage

1

Lastpage

6

Abstract

The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Non- leaded) packages. The important SMT factors such as solder pad and stencil designs will be discussed. Secondly and more importantly, this paper will detail the comprehensive experiment and simulation work done for QFN solder joint reliability modeling. A curve fitted fatigue correlation model together with the use of Schubert´s hyperbolic sine lead-free solder constitutive model will be proposed for accurate QFN solder joint reliability prediction.

Keywords

electronics packaging; fatigue; reliability; solders; surface mount technology; QFN packages; SMT; board-level surface mount technology assembly; curve fitted fatigue correlation; hyperbolic sine lead-free solder constitutive model; quad flat nonleaded packages; solder joint reliability; solder pads; stencil designs; Assembly; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Leg; Soldering; Sun; Surface-mount technology; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Conference_Location

London

Print_ISBN

1-4244-1105-X

Electronic_ISBN

1-4244-1106-8

Type

conf

DOI

10.1109/ESIME.2007.360010

Filename

4201177