Development of Reliability Verification System for Robust Package Design

Author

Shin, Dongkil ; Baek, Hyunggil ; Oh, Joonyoung ; Kwak, Dongok ; Kim, Kuyoung ; Song, Younghee ; Kim, Jeongyeol

Author_Institution

IPT Team, Samsung Electron. Co., Hwasung

fYear

2007

fDate

16-18 April 2007

Firstpage

1

Lastpage

7

Abstract

To achieve design for reliability (DFR), a reliability verification system (RVS) was developed. Package level and board level reliabilities were predicted by the developed system automatically and the design for six sigma (DFSS) was achieved. Process server and database server were developed. FEM mesh was generated automatically by well-organized builder, simulation conditions were assigned by standardized procedure, and reliabilities were calculated by developed life models. All data related to the simulation were managed by database system. High quality simulation was carried out easily and quickly. Robust package design was achieved by design optimization using the RVS.

Keywords

design for quality; electronics packaging; finite element analysis; reliability; six sigma (quality); FEM mesh; board level reliability; database server; design-for-reliability; design-for-six sigma; high quality simulation; package design; package level reliability; process server; reliability verification system; Consumer electronics; Costs; Design optimization; Electronics packaging; Manufacturing processes; Product design; Qualifications; Raw materials; Robustness; Six sigma;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Conference_Location

London

Print_ISBN

1-4244-1105-X

Electronic_ISBN

1-4244-1106-8

Type

conf

DOI

10.1109/ESIME.2007.360020

Filename

4201187