DocumentCode
2587206
Title
Distributed Optimization of Temperature Field for Reliable Construction of Electronic Circuits
Author
Butrylo, Boguslaw
Author_Institution
Fac. of Electr. Eng., Bialystok Tech. Univ.
fYear
2006
fDate
13-17 Sept. 2006
Firstpage
470
Lastpage
476
Abstract
Sequential and distributed implementations of optimization algorithm are validated and applied for the optimization of the temperature field distribution in electronic circuits. The approximated, analytical solution of heat transfer equation is implemented to determine the temperature distribution in the circuit. The genetic algorithm is applied in the computations of the optimal displacement of the components in the circuit. Three different methods of the task and/or domain partitioning in the distributed algorithm are discussed
Keywords
distributed algorithms; electronic engineering computing; heat transfer; optimisation; temperature distribution; distributed optimization algorithm; domain partitioning; electronic circuit; heat transfer equation; optimal displacement; temperature field distribution; Circuit analysis; Concurrent computing; Distributed computing; Electronic circuits; Heat transfer; Iterative algorithms; Minimization; Optimization methods; Space technology; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel Computing in Electrical Engineering, 2006. PAR ELEC 2006. International Symposium on
Conference_Location
Bialystok
Print_ISBN
0-7695-2554-7
Type
conf
DOI
10.1109/PARELEC.2006.31
Filename
1698707
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