DocumentCode
2587511
Title
Package design for high performance ICs
Author
Dandia, Sanjay
Volume
3
fYear
2004
fDate
16-20 Feb. 2004
Abstract
This article deals about package design for high performance ICs. Product development for any high performance chip is a co-design process between a chip and a package designer. Wire bond packages have been developed using new design process. Flip chip design process was also been reviewed using a 1312GA package as a vehicle.
Keywords
flip-chip devices; integrated circuit design; integrated circuit packaging; lead bonding; product development; co-design process; flip chip design process; integrated circuits; package design; product development; wire bond packages; Bonding; Design methodology; Electronic design automation and methodology; Flip chip; Integrated circuit packaging; Performance analysis; Process design; Product development; Vehicles; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
ISSN
1530-1591
Print_ISBN
0-7695-2085-5
Type
conf
DOI
10.1109/DATE.2004.1269188
Filename
1269188
Link To Document