Thin-film multilayer Parylene interposer for high-density 3D packaging with embedded capacitors

Summary form only given, as follows. A novel all-Parylene based multilayer organic interposer for high-density 3D packaging has been presented. Low-loss materials are deposited in very thin layers, coinciding with thicker flexible structural layers. High density embedded capacitors are implemented on a Parylene substrate by virtue of an ultra-thin (∼ 47 nm) deposition of Parylene-N. These are shown to have relatively high voltage breakdown, indicating a good film quality. High valued capacitors as high as 450 pF are created. The applicability of the embedded capacitors are demonstrated with an RF powering test vehicle.