• DocumentCode
    2591124
  • Title

    Thousands of microcantilevers for highly parallel and ultra-dense data storage

  • Author

    Vettiger, P. ; Albrecht, T. ; Despont, M. ; Drechsler, U. ; Durig, U. ; Gotsmann, B. ; Jubin, D. ; Haberle, W. ; Lantz, M.A. ; Rothuizen, H. ; Stutz, R. ; Wiesmann, D. ; Binnig, G.K. ; Bachtold, P. ; Cherubini, G. ; Hagleitner, C. ; Loeliger, T. ; Pantazi

  • Author_Institution
    Micro-/Nanomechanics Group, IBM Zurich Res. Lab., Ruschlikon, Switzerland
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    Ultrahigh storage densities of up to 1 Tb/in./sup 2/ or more can be achieved by using local-probe techniques to write, read back, and erase data in very thin polymer films. The thermomechanical scanning-probe-based data-storage concept, internally dubbed "millipede", combines ultrahigh density, small form factor, and high data rates. High data rates are achieved by parallel operation of large 2D arrays with thousands micro/nanomechanical cantilevers/tips that can be batch-fabricated by silicon surface-micromachining techniques. The inherent parallelism, the ultrahigh areal densities and the small form factor may open up new perspectives and opportunities for application in areas beyond those envisaged today.
  • Keywords
    arrays; atomic force microscopy; digital storage; microactuators; microsensors; polymer films; storage media; 2D arrays; atomic force microscope; data rates; highly parallel data storage; local-probe techniques; micro/nanomechanical cantilevers/tips; microcantilevers; millipede; scanning-probe storage; silicon surface-micromachining; small form factor; storage density; thermomechanical scanning-probe-based data-storage concept; thin polymer films; ultra-dense data storage; Amorphous magnetic materials; Atomic force microscopy; Image storage; Laboratories; Magnetic confinement; Magnetic memory; Material storage; Polymer films; Probes; Random access memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269392
  • Filename
    1269392